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FUZIONSC PLATFORM

FuzionSC™ is Universal Instruments’ next-generation semiconductor platform, offering the industry’s most precise accuracy, highest flip chip throughput, and widest component range.

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HIGH-SPEED WAFER FEEDER

The High-Speed Wafer Feeder (HSWF) is the world’s fastest rapid-exchange multi-die feeder. Combined with Universal’s FuzionSC™ Platform, it is the ultimate multi-die solution for heterogeneous integration.

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FUZIONSC PLATFORM

Are high precision die and chip applications increasing your manufacturing costs while lowering your yields, resulting in decreased profits?

Universal Instruments’ FuzionSC™ Platform offers a complete solution to flip chip package applications by blending the strict accuracy demands of Semiconductor assembly with the speed and robustness of Universal’s Fuzion Platform. With the ability to handle all facets of flip chip assembly, FuzionSC reduces operating and capital costs by maximizing throughput per floor-space.

  • Silicon/SMT, high-accuracy/high-speed assembly
  • High accuracy: (±10µm, < 3µm placement repeatability)
  • Dual- or single-beam, multiple-spindle heads
  • Full range of die and component types and sizes
  • Versatile substrate handling
  • Broadest range of feeding platforms
  • Low-maintenance, accurate over time
  • Vision robustness recognition of pins or logic pads
  • Stacking support (POP)
  • Low-force capability
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FUZIONSC MODELS & SPECS
  • FuzionSC1-11 – Flexible configuration delivering best-in-class throughput and accuracy for semiconductor applications. Offers the widest component range without reconfiguration.
  • FuzionSC2-14 – High-volume configuration delivering best-in-class throughput and accuracy for semiconductor applications. Maintains superior flexibility over dedicated solutions to support technology changes.
RESOURCES
FuzionSC Brochure

FuzionSC Brochure – Chinese

FuzionSC Condensed Datasheet

FuzionSC Condensed Datasheet – Chinese

Max Throughput (cph)
FuzionSC1-11
16,500
8,400 (4-Bd IPC Chips)
FuzionSC2-14
30,750
14,200 (4-Bd IPC Chips)
Accuracy (µm) at greater than 1.00 Cpk
FuzionSC1-11
±7
FuzionSC2-14
±7
Max Board Size
FuzionSC1-11
508 x 813mm
FuzionSC2-14
508 x 813mm
Max Feeder Inputs (8mm)
FuzionSC1-11
120 (2 ULC)
FuzionSC2-14
120 (2 ULC)
Component Range
FuzionSC1-11
0201 – 150mm sq, 25mm tall
FuzionSC2-14
0201 – 150mm sq, 25mm tall

HIGH-SPEED WAFER FEEDER

Consumer, Automotive and IoT devices are getting smaller and thinner, 2.5D and SiP multi-die packages are becoming more complex, InFO and Panel Fan-Out are driving large-format batch processing, and volume demands are rising. These new challenges demand a comprehensive solution that breaks traditional boundaries for efficient multi-die assembly.

The High-Speed Wafer Feeder (HSWF) meets these challenges head-on, delivering value with the precision, performance and flexibility to handle today’s most advanced applications, while also enabling you for those to come.

  • Maximum die size range with thinnest die
  • Maximum panel size processing up to 635mm x 610mm on FuzionSC
  • 14 high-precision (sub-micron X,Y,Z) servo-driven pick heads
  • High-precision (sub-micron X,Y,Z) servo-driven ejector
  • 100% pre-pick vision and die alignment
  • One-step “wafer-to-placement” handoff
  • Synchronous wafer stretch and storage
  • 16K cph dual wafer tables
  • Up to 52 unique wafers types at once; 100mm, 150mm, 200mm, 300mm
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HSWF MODELS & SPECS
  • FuzionSC1-11 – Flexible configuration delivering best-in-class throughput and accuracy for semiconductor applications. Offers the widest component range without reconfiguration.
  • FuzionSC2-14 – High-volume configuration delivering best-in-class throughput and accuracy for semiconductor applications. Maintains superior flexibility over dedicated solutions to support technology changes.
RESOURCES
High-Speed Wafer Feeder Datasheet
Single-Bay HSWF
Placement Mode
Flip Chip (Circuit Down)
Die Attach (Circuit Up)
Wafer Tables
1
Wafer Cartridges
4
Throughput (cph)
Flip Chip: 8,000
Die Attach: 7,400
Die Size (Min)
0.5mm x 0.5mm
Die Size (Max)
70mm x 70mm
Die Thickness (μm)
50 to 1,000
Max Part Numbers / FuzionSC
Up to 26 die types
Cassette Capacity
13 wafers/cassette x 2
25 wafers/cassette x 1
Wafer Size (mm/inches)
100/4”, 150/6”, 200/8”, 300/12”
Nozzle / Ejector Change
Auto Changer
Nozzle Changer Slots
28
Ejector
4 Ejector Changer
Traceability
GEM/SQL
Mapping System
Local Map Support
Dual-Bay HSWF
Placement Mode
Flip Chip (Circuit Down)
Die Attach (Circuit Up)
Wafer Tables
2
Wafer Cartridges
8
Throughput (cph)
Flip Chip: 16,000
Die Attach: 14,400
Die Size (Min)
0.5mm x 0.5mm
Die Size (Max)
70mm x 70mm
Die Thickness (μm)
50 to 1,000
Max Part Numbers / FuzionSC
Up to 52 die types
Cassette Capacity
13 wafers/cassette x 2
25 wafers/cassette x 1
Wafer Size (mm/inches)
100/4”, 150/6”, 200/8”, 300/12”
Nozzle / Ejector Change
Auto Changer
Nozzle Changer Slots
56
Ejector
8 Ejector Changer
Traceability
GEM/SQL
Mapping System
Local Map Support