23.5 mm, 300 pos. Teradyne NeXLev Bd to Bd Receptacle (BGA style) – RFQ01143

  • Component: RFQ01143
  • Description: 23.5 mm, 300 pos. Teradyne NeXLev Bd to Bd Receptacle (BGA style)
  • Component Category: Connector
  • Sub-Category: Board to Board Connector
  • How Presented: Tray
  • Pick Specifics: Pick off top surface of pick tab. Off center pick required.
  • Type of Head Nozzle Part # ID #
  • Flex/Inline4 (4 Spindle Head) 49523621
  • Application Notes: Requirements For All Ball Inspection : UPS 4.5 software with custom BGA Algorithm part number 49610602 is required. This special BGA Algorithm is developed for 2.6 mil Circular Lighting Camera (Upper Looking Camera) with AIS-630 Vision System only. Placement force of 350 grams is required, a higher placement pressure may be desirable. Requirements for Pick and Placement: · In the nozzle database, Select Keyed and symmetric Select No. In the component database, Pre-orient will be No. Feeder Teach will be required. Feeder teach center of pick tab. Go to The Feeder Database. For a GSM1 machine, add .075″ to the pickup Y value. For a GSM2 machine subtract .075″ from the pickup Y value. This will allow the special offset nozzle to pick on the center of the pick tab. Placements will be limited to 0 or +/- 90 degrees on the PC Board. The NeXLev connector can run on a GSM1 or GSM2 machine using spindles 1 or 4. The GSM2 must be on the fear feeder bank and inbound 8.5 inches. The NeXLev connector will be in it’s own task block with one placement per task block and a repair step after every task block. NeXLev connectors will NOT be able to pass over one another. The connector will be the last component placed in a product. Z-safe software will need to be activated when picking the NeXLev connector. Remove tool option will need to be activated when picking the NeXLev connector. To transfer the PC board out of the machine, staged board handling will need to be turned off and Alternate Park step will need to be used to avoid hitting the yoke. Photo Switch Assemblies will need to be adjusted so they do not interfere with the NeXLev connector during board transfer. The black cover will need to be modified for board transfer on the exit side of the GSM machine.
  • Component Manufacturer: Teradyne Connection Systems
  • Manufacturer Part Number: 4703235100
  • Vision Information:
  • (Component Measurements) RFQ01143
  • Component Definition: